IC Module Production

 Die Bonder: Die bonding is assembly of the chip onto the IC module tape. Wire Bonder: The contract pads of the chip are electrically connected pads of the tape by approximately 25 ┬Ám gold wires. Chip modules Encapsulation: Resin is dispensed to protect the chip and wi res against mechanical and environmental stress. Chip Module Test: As an output of functional test the IC modules are electrically tested. Glue Tape Lamination : The preparation of the modules tapes for the hot melt implanting process. Chip modules are laminated on the back side with an adhesive tape