IC Module Production
Die Bonder: Die bonding is assembly
of the chip onto the IC module tape.
Wire Bonder: The contract pads of
the chip are electrically connected
pads of the tape by approximately 25
µm gold wires.
Chip modules Encapsulation: Resin is
dispensed to protect the chip and
wi res against mechanical and
environmental stress.
Chip Module Test: As an output of
functional test the IC modules are
electrically tested.
Glue Tape Lamination : The
preparation of the modules tapes for
the hot melt implanting process. Chip
modules are laminated on the back
side with an adhesive tape